14/13/12th Gen Intel® Core™ Modular GPU Computer, Supports Dual Full-length GPU Expansion Up to 500W

The GP-3100 is a high-performance GPU computer for industrial AI and machine vision applications. It supports an Intel® Core™ processor, up to two 250W full-length GPU cards, high-capacity storage, and high-speed I/O.
Three patented features, designed for specific customer needs, improve expansion, heat dissipation, and overall stability, making the GP-3100 an ideal choice for complex Edge AI applications.

Product Features:
- Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
- 2 x DDR5 SO-DIMM Sockets, Supports ECC/non ECC type Memory, Up to 4800MHZ, 64GB
- 4x 2.5GbE LAN and optional 2x 10GbE LAN
- 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
- 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
- 1 x M.2 Key B Type 2280 Socket for Add-on Card Expansion
- 4 x 2.5″ Hot Swappable SATA III HDD/SSD Bays (Max Height 15 mm) , 1x M.2 key M for NVMe SSD
- Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
- Versatile Mounting Methods (Tower Stand / Desktop / 19”Rack / Flat / Wall Mount)
- Wide Operating Temperature -40°C to 70°C
Ultimate CPU + GPU Performance
Equipped with a 14th generation Intel® Core™ (Raptor Lake-S Refresh) processor, the GP-3100 is capable of three times the computing performance of its predecessor. The GP-3100 supports up to two 250W high-end GPU cards and 5600MHz DDR5 memory with ECC for a complete AI computing solution.

Scalable and Upgradeable GPU Expansion Box
The dual-patented GPU expansion box (GEB) supports up to two 328mm high-end full-length GPU cards and includes multiple built-in PCIe slots for flexible use with high-speed I/O or frame grabber cards.
The patented adjustable 3D GPU Card Mounting Bracket is designed for high-vibration environments and can firmly lock all GPU cards. For flexible future upgrades, the GEB can be replaced to add a higher-end GPU card or an expansion card.

Comprehensive Cooling Design
To solve the power consumption and thermal challenges, the GP-3100’s mechanical structure and isolated external smart fan kits on both sides of the chassis effectively dissipate heat under full workloads in extreme conditions.

Rich Modular Design and Expandability
AI applications need high-speed transmission and high-capacity storage, so the GP-3100 has 4x 2.5GbE LAN, 6x USB 3.2, 4x front-accessible 2.5” HDD/SSD, and NVMe SSD. Rich scalability capabilities include exclusive modular technology (CMI and CFM) and an M.2 slot that supports CAN bus and other modules to meet various application needs.

International Standards and Certifications
Rugged design passes or complies with multiple industrial standards and certifications, including MIL-STD-810H US military shock resistance, E-mark, and EN 50155 (EN 50121-3-2 only), to ensure high reliability in various application environments.

GP-3100 Product Video
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